Embedded die packaging technology is a technology in which the die is directly embedded into printed circuit board laminated substrate. This technology is widely used in manufacturing and it provides several benefits such as size reduction, power saving, and improving the overall system efficiency on a large scale.
The advantages of this technology comprise improved electrical and thermal performance, miniaturization, heterogeneous integration, reduction in cost, and efficient logistics for OEM. In addition, it provides flexible system integration, high robustness, fast turnaround for custom design, and enhanced reliability of the package.
Get PDF Sample Copy of this Report @ https://www.theinsightpartners.com/sample/TIPRE00004132
The embedded die packaging technology market is anticipated to grow owing to the factors such as the increase in number of portable electronic devices, imminent need for circuit miniaturization in microelectronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. Further, the rapid adoption of IoT globally is expected to provide opportunities for embedded die packaging technology market to grow. However, the requirement of high cost of these chips restraints for the growth of the market.
Top Leading Market Players:
1.Advanced Semiconductor Engineering, Inc.2.Amkor Technology, Inc.3.ATandS4.Fujikura Ltd.5.Infineon Technologies AG6.Microsemi (Microchip Technology Inc.)7.SCHWEIZER ELECTRONIC AG8.SHINKO ELECTRIC INDUSTRIES CO.,LTD.9.Taiwan Semiconductor Manufacturing Company Ltd.10.TDK Corporation
The global embedded die packaging technology market is segmented on the basis of platform, application, and industry vertical. Based on platform, the market is segmented as Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board. Further, based on application, the market is divided into Sports/Fitness Devices, Medical Implants and Wearable Devices, Industrial Sensing, Security Technologies, and Others. Furthermore, on basis of industry vertical, market is segmented as Consumer Electronics, IT & Telecommunication, Automotive, Healthcare, and Others.
Every crucial and decisive detail for the development of the market and the restraining factors that may hamper the market in near future is mentioned with solutions in the report. Segmentations of the market are studied specifically to give profound knowledge for supplementary market investments.
Enquiry for Discount @ https://www.theinsightpartners.com/discount/TIPRE00004132
The Embedded Die Packaging Technology Market report is a combination of qualitative as well as quantitative analysis which can be broken down into 40% and 60% respectively. Market estimation and forecasts are presented in the report for the overall global market from 2018 – 2027, considering 2018 as the base year and 2018 – 2027 forecast period. Global estimation is further broken down by segments and geographies such as North America, Europe, Asia-Pacific, Middle East & Africa and South America covering major 16 countries across the mentioned regions. The qualitative contents for geographical analysis will cover market trends in each region and country which includes highlights of the key players operating in the respective region/country, PEST analysis of each region which includes political, economic, social and technological factors influencing the growth of the market.